发明名称 THREE DIMENSIONAL MEMORY ARRAY WITH SELECT DEVICE
摘要 Three dimensional memory arrays and methods of forming the same are provided. An example three dimensional memory array can include a stack comprising a plurality of first conductive lines separated from one another by at least an insulation material, and at least one conductive extension arranged to extend substantially perpendicular to the plurality of first conductive lines such that the at least one conductive extension intersects each of the plurality of first conductive lines. Storage element material is arranged around the at least one conductive extension, and a select device is arranged around the storage element material. The storage element material is radially adjacent an insulation material separating the plurality of first conductive lines, and the plurality of materials arranged around the storage element material are radially adjacent each of the plurality of first conductive lines.
申请公布号 US2014361239(A1) 申请公布日期 2014.12.11
申请号 US201313915302 申请日期 2013.06.11
申请人 Micron Technology, Inc. 发明人 Ramaswamy D.V. Nirmal;Sills Scott E.;Sandhu Gurtej S.
分类号 H01L27/24;H01L45/00 主分类号 H01L27/24
代理机构 代理人
主权项 1. A three dimensional memory array, comprising: a stack comprising a plurality of first conductive lines separated from one another by at least an insulation material; at least one conductive extension arranged to extend substantially perpendicular to the plurality of first conductive lines, such that the at least one conductive extension intersects each of the plurality of first conductive lines; storage element material arranged around the at least one conductive extension; and a select device arranged around the storage element material, wherein the storage element material is radially adjacent an insulation material separating the plurality of first conductive lines, and the plurality of materials arranged around the storage element material are radially adjacent each of the plurality of first conductive lines.
地址 Boise ID US