COMPOSITION FOR CERAMIC SUBSTRATES AND CERAMIC CIRCUIT COMPONENT

摘要

Provided is a composition for ceramic substrates, whereby a ceramic substrate having excellent insulation reliability can be obtained. The composition for ceramic substrates comprises a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder includes 4-8 wt% B2O3, 38-44 wt% SiO2, 3-10 wt% Al2O3, and 40-48 wt% MO (MO being at least one type selected form CaO, MgO, and BaO). The mixing ratio of the borosilicate glass powder and the ceramic powder is set such that the borosilicate glass powder content is 50-56 wt% and the ceramic powder content is 50-44 wt%. The ceramic powder has an average particle diameter (D50) of 0.4-1.5 µm. As a result of molding and sintering this composition, a ceramic substrate (2) for provision in a ceramic circuit component (1) can be obtained.