| 摘要 |
<p>Provided is a glass film cleaving method, comprising: a full-body cleaving step of cleaving a full-body of a glass film (GF) having a thickness of 200 µm or less by propagating an initial crack (8) along a preset cleaving line (4, 5) through heating of the glass film (GF) with a laser beam (9) followed by subsequent cooling of the glass film (GF); and a laminate manufacturing step of manufacturing a glass film laminate (S) by setting a surface roughness Ra of each of a surface of the glass film (GF) to be brought into contact with a support glass (GS), which is configured to support the glass film, and a surface of the support glass (GF) to be brought into contact with the glass film to 2.0 nm or less, and by bringing the surface of the glass film and the surface of the support glass into surface contact with each other, followed by the full-body cleaving step.</p> |
