| 发明名称 |
LIGHT EMITTING CHIP |
| 摘要 |
A light emitting chip including a device chip having a transparent substrate and a light emitting layer formed on a front side of the transparent substrate, and a transparent resin layer provided on a back side of the transparent substrate. The transparent resin layer contains transparent particles for transmitting and scattering light emitted from the light emitting layer. |
| 申请公布号 |
US2014361307(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414295806 |
申请日期 |
2014.06.04 |
| 申请人 |
DISCO CORPORATION |
发明人 |
Okamura Takashi;Suzuki Minoru |
| 分类号 |
H01L33/60;H01L33/62;H01L33/32 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting chip comprising:
a device chip having a transparent substrate and a light emitting layer formed on a front side of said transparent substrate; a transparent resin layer provided on a back side of said transparent substrate; and transparent particles contained in said transparent resin layer for transmitting and scattering light emitted from said light emitting layer. |
| 地址 |
Tokyo JP |
