| 摘要 |
The purpose of the present invention is to ensure the accuracy of positioning of a printed substrate on which through-holes are provided, and to be able to reliably insert external terminals into the through-holes even when the external terminals are inclined. A semiconductor device (50) is provided with a DCB substrate (4) to which semiconductor elements (6) are joined, external terminals (10) inserted into recesses (12) provided on the DCB substrate (4), and a printed substrate (9) having through-holes (13) and post electrodes (8) which are disposed so as to face the DCB substrate (4). Slits (15) are formed on the peripheral areas of the through-holes (13) of the printed substrate (9) through which the external terminals (10) are inserted. |
