METHOD OF DETECTING FAULTS OF OPERATION RECIPES IN A WIRE BONDING MACHINE AND APPARATUS FOR PERFORMING THE SAME

摘要

According to a method of detecting a fault of an operation condition in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine are set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package are formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.