| 摘要 |
PROBLEM TO BE SOLVED: To expand chips in an equal and preset separation distance even in the case where a dicing tape is anisotropic or an aspect ratio of a chip shape is different.SOLUTION: A work dividing device comprises: cooling means 14 for a work unit 12; and work dividing means 16 for expanding a dicing tape S and dividing a wafer W into chips T. The work dividing means 16 includes: a frame F that can be divided into at least four substantially equal frame divisions; expansion means 26 for holding the frame divisions of the frame F in a freely removable manner, pulling and dividing the frame divisions in a direction where the frame F is widened, thereby expanding the dicing tape S; imaging means 28 for imaging a separation distance of the chips which are divided along a predetermined division line by expanding the dicing tape S; and tensile force adjusting means 30 for adjusting tensile forces of the expansion means 26 on the basis of the separation distance of the chips imaged by the imaging means 28. |
