| 摘要 |
This semiconductor device is provided with a first substrate, a second substrate, a connection part and an alignment mark. The connection part is provided with a first electrode that is arranged on the first substrate, a second electrode that is arranged on the second substrate, and a connection bump that connects the first electrode and the second electrode with each other. The alignment mark is provided with a first mark that is arranged on the first substrate and a second mark that is arranged on the second substrate. The sum of the height of the first mark and the height of the second mark is generally equal to the sum of the height of the first electrode, the height of the second electrode and the height of the connection bump. |
