PIEZOELECTRIC DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
摘要
<p>The present invention relates to a piezoelectric device package including: a case which has a plurality of ports formed in the bottom; a piezoelectric device formed in the case; a thin film temperature measuring device formed on one surface of the piezoelectric device, in the case; and a cover member for sealing the case.</p>
申请公布号
KR20140142015(A)
申请公布日期
2014.12.11
申请号
KR20130063532
申请日期
2013.06.03
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, JONG PIL;CHA, SANG YEOB;LEE, SOON BUM;JEON, JONG BEOM;YASUDA KATSUSHI
