PHOTOCURABLE RESIN AND PHOTOCURABLE RESIN COMPOSITION

摘要

The purpose of the present invention is to provide a photocurable resin composition which exhibits high adhesive strength and good adhesive properties under conditions of high temperature and high humidity, and a photocurable resin used in this photocurable resin composition. This photocurable resin has a specific proportion of a repeating unit derived from 1,2-butadiene in the main chain skeleton, has a (meth)acryloyloxy group linked via a prescribed urethane bond at at least one terminal, and has at least two urethane bonds in the main chain skeleton.