HEAT DISSIPATION STRUCTURE, PRODUCTION METHOD THEREFOR AND ELECTRONIC DEVICE

摘要

A heat dissipation structure has a plurality of linear structures (12) from carbon element, whereof at least one extremity (14) is curved, and an envelope layer (16) formed on the surface of each linear structure, the thickness of the portion covering the other extremity (18) of the each linear structure being such a thickness that the each linear structure is plastically deformable.