POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE SUBSTRATE WITH COOLER, AND POWER MODULE

摘要

A power module substrate with a heatsink includes: a power module substrate 10 provided with a ceramic substrate 11, a circuit layer 12 and a metal layer 13; and a heatsink 18 bonded to the metal layer 13 via a solder layer 17 and composed of copper or a copper alloy. The metal layer 13 is formed by bonding an aluminum plate in which the content of Al is 99.0 to 99.85% by mass to the ceramic substrate 11, and the solder layer 17 is formed of a solid-solubilized-hardening type solder material including Sn as a major component and a solid-solubilized element being solid-solubilized into a matrix of Sn.