| 发明名称 |
LASER SCANNING FOR THERMAL PROCESSING |
| 摘要 |
A system is provided for thermal processing of a semiconductor substrate including a laser configured for emitting a laser beam towards the semiconductor substrate and a scanning means configured for scanning the laser beam along a first plurality of paths on the semiconductor substrate such that the paths are spaced apart from each other by predetermined distances. Further, a method for thermal processing of a semiconductor substrate is provided including scanning a laser beam along a first plurality of paths on the semiconductor substrate such that the paths are spaced apart from each other by predetermined distances. |
| 申请公布号 |
US2014363986(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201313912761 |
申请日期 |
2013.06.07 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Holub Jan |
| 分类号 |
H01L21/67;H01L21/268 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for thermal processing of a semiconductor substrate, comprising
a laser configured for emitting a laser beam towards said semiconductor substrate; and a scanning means configured for scanning said laser beam along a first plurality of paths on said semiconductor substrate such that the paths are spaced apart from each other by predetermined distances. |
| 地址 |
Grand Cayman KY |
