发明名称 |
Contact Structure of Semiconductor Device Priority Claim |
摘要 |
The invention relates to a contact structure of a semiconductor device. An exemplary structure for a contact structure for a semiconductor device comprises a substrate comprising a major surface and a trench below the major surface; a strained material filling the trench, wherein a lattice constant of the strained material is different from a lattice constant of the substrate; an inter-layer dielectric (ILD) layer having an opening over the strained material, wherein the opening comprises dielectric sidewalls and a strained material bottom; a semiconductor layer on the sidewalls and bottom of the opening; a dielectric layer on the semiconductor layer; and a metal layer filling an opening of the dielectric layer. |
申请公布号 |
US2014363943(A1) |
申请公布日期 |
2014.12.11 |
申请号 |
US201414469394 |
申请日期 |
2014.08.26 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wang Sung-Li;Shih Ding-Kang;Lin Chin-Hsiang;Sun Sey-Ping;Wann Clement Hsingjen |
分类号 |
H01L29/66;H01L29/78;H01L29/417;H01L29/06 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a semiconductor device, comprising:
providing a substrate comprising a major surface and a trench extending below the major surface; epitaxially growing a strained material in the trench, wherein a lattice constant of the strained material is different from a lattice constant of the substrate; forming an inter-layer dielectric (ILD) layer over the strained material; forming an opening in the ILD layer to expose a portion of the strained material; forming a semiconductor oxide layer on interior of the opening and extending over the ILD layer; forming a first metal layer over the semiconductor oxide layer; heating the substrate to form a semiconductor layer and a dielectric layer over the semiconductor layer; and forming a second metal layer in an opening of the dielectric layer. |
地址 |
Hsin-Chu TW |