| 发明名称 |
PRINTED CIRCUIT BOARD INCLUDING INDUCTOR |
| 摘要 |
A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element. |
| 申请公布号 |
US2014362551(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414255237 |
申请日期 |
2014.04.17 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MOON HYUN-JONG;Myung Bok-Sik;Shin Seong-Ho |
| 分类号 |
H01F27/28;H05K1/09;H05K1/02 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) comprising:
an insulating substrate; a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate; an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate; a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate; and a single through hole penetrating the insulating substrate and the insulating adhesive sheets, wherein the single through hole is disposed between the inductor and the grounding element. |
| 地址 |
Suwon-Si KR |
