| 发明名称 |
COOLING SYSTEM FOR AN ELECTRONIC RACK |
| 摘要 |
The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis. |
| 申请公布号 |
US2014362531(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414468869 |
申请日期 |
2014.08.26 |
| 申请人 |
Academia Sinica |
发明人 |
LEE SHIH-CHANG;CHU MING-LEE;LIN CHIH-HSUN |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling system for an electronic rack comprising:
an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronic equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis, wherein the first detachable thermal interface comprises a first plate and a second plate to form a contact between each other. |
| 地址 |
Taipei TW |
