| 摘要 |
Provided is an opto-electric hybrid substrate in which a metallic reinforcement layer is closely attached to an insulation layer of a flexible circuit board with no adhesive therebetween, and an element is appropriately mounted while deformation due to a pressing load when the element is mounted is suppressed by the metallic reinforcement layer. In this opto-electric hybrid substrate, a flexible double-sided circuit board (E) in which electric wirings (2A, 2B) are formed on the front and back surfaces of a flexible insulation layer (1) is used as an electric circuit board, and a metallic reinforcement layer (M) is formed by plating in a portion of the electric wiring (2B) on the back surface side, the portion corresponding to at least a mounting pad (2a) on the front surface side. An optical waveguide (W) is formed while being in contact with the electric wiring (2B) on the back surface side of the flexible double-sided circuit board (E). |
