| 摘要 |
<p>Provided are a flow path member that suppresses flow path breakage, a heat exchanger and a semiconductor device using the same. This flow path member (1) has a flow path (5) in which a fluid flows and which is constituted by a lid portion (2), a partition wall portion (3b), a side wall portion (3) and a bottom plate portion (4). At least one of the partition wall portion and the sidewall portion is partly embedded in at least one of the lid portion (2) and the bottom plate portion (4) for direct connection. Therefore, even if a thermal stress is repeatedly developed in the flow path member (1), breakage of junctures (8) of the lid portion (2), the partition wall portion (3b), the side wall portion (3) and the bottom plate portion (4) that constitute the flow path is suppressed, and sealing performance of the flow path (5) is increased. Further, breakage of the flow path (5) can be suppressed even if a high-pressure fluid is passed through the flow path (5), breakage of the flow path due to the thermal stress can be suppressed in a heat exchanger and a semiconductor device using the flow path member (1), heat exchange efficiency can be improved, and reliability can be improved.</p> |
