发明名称 |
PRESSURE SENSING IMPLANT |
摘要 |
<p>A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.</p> |
申请公布号 |
CA2907419(A1) |
申请公布日期 |
2014.12.11 |
申请号 |
CA20142907419 |
申请日期 |
2014.03.17 |
申请人 |
ENDOTRONIX, INC. |
发明人 |
ROWLAND, HARRY;NAGY, MICHAEL;WATKINS, ROGER;SUNDARAM, BALAMURUGAN;SUNDARAM, SURESH |
分类号 |
G01D11/24;G01L9/12;G01L19/14 |
主分类号 |
G01D11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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