| 摘要 |
PROBLEM TO BE SOLVED: To provide a printing head unit and a printer in which heat radiation performance of drive ICs embedded in a head substrate is improved.SOLUTION: A head substrate 241 is a multilayer substrate constituted by laminating plural layers of a first layer P1 to a sixth layer P6. The head substrate 241 embeds head drive ICs 431 inside by mounting the head drive ICs 431 to a copper layer L5. At a copper layer L1, metal layers 401 are arranged in the area of superposing on the head drive ICs 431 mounted on the copper layer L5 in a plan view. At the metal layers 401, many heat transfer parts 60 are provided. Each heat transfer part 60 is constituted by a penetration hole 61 which is formed as penetrating for each metal layer 401 that is arranged from the head drive IC 431 side embedded in the head substrate 241 to the copper layer L1 and a heat transfer layer 62 formed at the inner periphery surface of the penetration hole 61. Heat from the head drive IC 431 is transferred to the metal layer 401 through each heat transfer part 60. |
