发明名称 |
POLYAMIC ACID SOLUTION |
摘要 |
The present invention relates to a polyamic acid solution and a display device, and more specifically, to a polyamic acid solution which can be used for a base layer or a protective layer of a display device, and a display device including a film formed by the imidization of the polyamic acid solution. The polyamic acid solution has excellent thermal characteristics such as a low coefficient of thermal expansion and a high thermal decomposition temperature, and can thus be applied to a base layer or a protective layer of a display device. |
申请公布号 |
US2014364564(A1) |
申请公布日期 |
2014.12.11 |
申请号 |
US201214369084 |
申请日期 |
2012.12.26 |
申请人 |
KOLON INDUSTRIES, INC. |
发明人 |
Hong Ki Il;Min Woong Ki |
分类号 |
C09D179/08 |
主分类号 |
C09D179/08 |
代理机构 |
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代理人 |
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主权项 |
1. A polyamic acid solution for forming a base layer or protective layer of a display device, wherein the polyamic acid solution is a reaction product of an aromatic dianhydride and an aromatic diamine, and wherein, at the time of forming the solution into an imidized film, the imidized film has a thermal expansion coefficient of 5 ppm/° C. or less at a temperature range of 50-450° C. and a thermal decomposition temperature of 500° C. or more, the thermal decomposition temperature being defined as a temperature at which a weight reduction rate measured by a thermogravimetric analyzer reaches 1%. |
地址 |
Gwacheon-si, Gyeonggi-do KR |