发明名称 POLYAMIC ACID SOLUTION
摘要 The present invention relates to a polyamic acid solution and a display device, and more specifically, to a polyamic acid solution which can be used for a base layer or a protective layer of a display device, and a display device including a film formed by the imidization of the polyamic acid solution. The polyamic acid solution has excellent thermal characteristics such as a low coefficient of thermal expansion and a high thermal decomposition temperature, and can thus be applied to a base layer or a protective layer of a display device.
申请公布号 US2014364564(A1) 申请公布日期 2014.12.11
申请号 US201214369084 申请日期 2012.12.26
申请人 KOLON INDUSTRIES, INC. 发明人 Hong Ki Il;Min Woong Ki
分类号 C09D179/08 主分类号 C09D179/08
代理机构 代理人
主权项 1. A polyamic acid solution for forming a base layer or protective layer of a display device, wherein the polyamic acid solution is a reaction product of an aromatic dianhydride and an aromatic diamine, and wherein, at the time of forming the solution into an imidized film, the imidized film has a thermal expansion coefficient of 5 ppm/° C. or less at a temperature range of 50-450° C. and a thermal decomposition temperature of 500° C. or more, the thermal decomposition temperature being defined as a temperature at which a weight reduction rate measured by a thermogravimetric analyzer reaches 1%.
地址 Gwacheon-si, Gyeonggi-do KR