| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic element mounting substrate capable of attaining downsizing and multi-pin configuration, and an electronic device.SOLUTION: The electronic element mounting substrate comprises at least: an insulation base 2 which is made of ceramic and includes a frame part including a first frame part 2a formed from a first insulation layer and a second frame part 2b formed from a second insulation layer, the second frame part 2b being provided on a bottom face of the first frame part 2a; an electronic element connection pad 3 provided on a top face of the frame part; a first wall surface conductor 4 electrically connected to the electronic element connection pad 3 and exposed from the insulation base 2 on an inner wall surface of the first frame part 2a; and a second wall surface conductor 5 electrically connected to the first wall surface conductor 4 and exposed from the insulation base 2 on an inner wall surface of the second frame part 2b. The electronic element mounting substrate includes, in a planar perspective view, an area in which the inner wall surface of the first frame part 2a and the inner wall surface of the second frame part 2b are disposed while being deviated and the first wall surface conductor 4 and the second wall surface conductor 5 are not overlapped. |
