发明名称 |
METHOD FOR FORMING RESIN CURED FILM PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING TOUCH PANEL, AND RESIN CURED FILM |
摘要 |
The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 μm or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator. |
申请公布号 |
US2014363767(A1) |
申请公布日期 |
2014.12.11 |
申请号 |
US201214362726 |
申请日期 |
2012.12.04 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Murakami Yasuharu;Yamazaki Hiroshi;Igarashi Yoshimi;Sasahara Naoki;Mukai Ikuo |
分类号 |
G03F7/038;G03F7/004 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a resin cured film pattern comprising
a first step in which on a base material there is formed a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 μm or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer,wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator. |
地址 |
Chiyoda-ku,Tokyo JP |