发明名称 |
ACOUSTIC WAVE DEVICE |
摘要 |
An acoustic wave device includes: a piezoelectric film located on a substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film; a temperature compensation film located on a surface, which is opposite to the piezoelectric film, of at least one of the lower electrode and the upper electrode and having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric film; and an additional film located on a surface of the temperature compensation film opposite to the piezoelectric film and having an acoustic impedance greater than an acoustic impedance of the temperature compensation film. |
申请公布号 |
US2014361664(A1) |
申请公布日期 |
2014.12.11 |
申请号 |
US201414275597 |
申请日期 |
2014.05.12 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
TANIGUCHI Shinji;NISHIHARA Tokihiro |
分类号 |
H03H9/02 |
主分类号 |
H03H9/02 |
代理机构 |
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代理人 |
|
主权项 |
1. An acoustic wave device comprising:
a piezoelectric film located on a substrate; a lower electrode and an upper electrode facing each other across the piezoelectric film; a temperature compensation film located on a surface, which is opposite to the piezoelectric film, of at least one of the lower electrode and the upper electrode and having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric film; and an additional film located on a surface of the temperature compensation film opposite to the piezoelectric film and having an acoustic impedance greater than an acoustic impedance of the temperature compensation film. |
地址 |
Tokyo JP |