发明名称 PRESSURE SENSING IMPLANT
摘要 <p>A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.</p>
申请公布号 WO2014197101(A2) 申请公布日期 2014.12.11
申请号 WO2014US30661 申请日期 2014.03.17
申请人 ENDOTRONIX, INC. 发明人 ROWLAND, HARRY;NAGY, MICHAEL;WATKINS, ROGER;SUNDARAM, BALAMURUGAN;SUNDARAM, SURESH
分类号 G01L9/12 主分类号 G01L9/12
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