ETCHANT AND ETCHANT KIT, ETCHING METHOD USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide an etchant capable of selectively removing a layer containing a specific metal from a layer containing Ge, an etchant kit, an etching method using the same, and a method for manufacturing a semiconductor substrate product.SOLUTION: An etchant for selectively removing a second layer from a semiconductor substrate which has a first layer containing germanium (Ge) and the second layer containing a specific metal element other than germanium (Ge), and containing an organic alkali compound.