Optical Wafer and Die Probe Testing

摘要

An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die (157) and surrounding scribe grid (156) to a test head (155) which is positioned over a wafer (160) in alignment with a die under test (163) and surrounding scribe grid (161, 165), such that one or more optical deflection mirrors (152, 154) in the test head scribe grid (156) are aligned with one or more optical deflection mirrors (162, 164) in the scribe grid (161, 165) for the die under test (163) to enable optical die probe testing on the die under test (163) by directing a first optical test signal (158) from the production test die (157), through the first and second optical deflection mirrors (e.g., 152, 162) and to the first die.

主权项

1. A method comprising:
providing a wafer comprising a first die of a predetermined size surrounded by a first scribe grid comprising a first optical deflection mirror positioned in the first scribe grid for receiving an optical test signal in a first plane that is perpendicular to the lateral plane of the wafer and for perpendicularly deflecting the received optical test signal to an optical waveguide beam located in the first die; providing a test head comprising a production test die surrounded by a second scribe grid comprising a second optical deflection mirror positioned in the second scribe grid for receiving an optical test signal in a lateral plane of the production test die and for perpendicularly deflecting the received optical test signal to a second plane that is perpendicular to the lateral plane of the production test die; positioning the test head over the wafer to perform optical die probe testing on the first die by aligning the first optical deflection mirror and the second optical deflection mirror; and performing optical die probe testing on the first die by directing a first optical test signal from the production test die, through the second and first optical deflection mirrors, and to the first die.