| 发明名称 |
SOLDER ALLOYS |
| 摘要 |
A solder comprising a bismuth matrix, between about 5-24% copper; and about 0.5-36% tin or antimony or zinc; having a solidus temperature of ≧271° C., a reflow temperature of ≦375° C., and at least one intermetallic composition precipitate comprising copper and at least one of tin, antimony and zinc substantially excluding bismuth formed within the solidus phase. |
| 申请公布号 |
US2014361070(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414296692 |
申请日期 |
2014.06.05 |
| 申请人 |
The Research Foundation for The State University of New York |
发明人 |
Cho Junghyun |
| 分类号 |
B23K35/26;B23K1/20 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solder comprising:
between about 5-24% copper; about 4-25% tin or antimony or zinc; and at least 50% by weight bismuth; having a solidus temperature of ≧271° C., a reflow temperature of ≦375° C., and at least one intermetallic composition precipitate comprising copper and at least one of tin, antimony and zinc substantially excluding bismuth formed within the solidus phase. |
| 地址 |
Binghamton NY US |
