WAFER CARRIER HAVING THERMAL UNIFORMITY-ENHANCING FEATURES

摘要

A wafer carrier assembly for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition (CVD), the wafer carrier assembly includes a wafer carrier body formed symmetrically about a central axis, and including a generally planar top surface that is situated perpendicularly to the central axis and a planar bottom surface that is parallel to the top surface. At least one wafer retention pocket is recessed in the wafer carrier body from the top surface. Each of the at least one wafer retention pocket includes a floor surface and a peripheral wall surface that surrounds the floor surface and defines a periphery of that wafer retention pocket. At least one thermal control feature includes an interior cavity or void formed in the wafer carrier body and is defined by interior surfaces of the wafer carrier body.

主权项

1. A wafer carrier assembly for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition (CVD), the wafer carrier assembly comprising:
a wafer carrier body formed symmetrically about a central axis, and including a generally planar top surface that is situated perpendicularly to the central axis and a planar bottom surface that is parallel to the top surface; at least one wafer retention region in the wafer carrier body, each of the at least one wafer retention region including a bore through the wafer carrier body extending from the top surface through the bottom surface and defined by an interior peripheral surface of the wafer carrier body, the wafer retention region further including a support shelf recessed below the top surface and situated along the interior peripheral surface, the support shelf being adapted to retain a wafer within the wafer retention region when subjected to rotation about the central axis.