RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by Rmax (μm), and when a maximum peak diameter in the volume particle diameter distribution of the particles contained in the inorganic filler is represented by R (μm), R