发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND COMPUTER-READABLE STORAGE MEDIUM RECORDING THEREIN SUBSTRATE PROCESSING PROGRAM
摘要 A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.
申请公布号 US2014360536(A1) 申请公布日期 2014.12.11
申请号 US201414296813 申请日期 2014.06.05
申请人 Tokyo Electron Limited 发明人 Kawabuchi Yosuke;Kawano Hisashi;Tanaka Satoru;Suzuki Hiroyuki;Oishi Kotaro;Shinohara Kazuyoshi;Yoshida Yuki
分类号 H01L21/67 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate processing apparatus that processes a substrate with a processing liquid and dries the substrate, the substrate processing apparatus comprising: a substrate rotating device configured to rotate the substrate; a processing liquid discharging unit configured to discharge the processing liquid toward the substrate; a substitution liquid discharging unit configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate, toward the substrate while relatively moving with respect to the substrate; and an inert gas discharging unit configured to discharge an inert gas toward a peripheral portion of the substrate in an inclined direction from above the substrate while moving in a direction different from a direction in which the substitution liquid discharging unit is moved.
地址 Tokyo JP
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