| 摘要 |
Articles are provided, having a first substrate and a polymeric structure wrapped around the first substrate at least two full circuits. The polymeric structure has a length, a width and a thickness, and comprises a crosslinked polymeric layer uniaxially oriented in the width direction at a draw ratio of at least 1.2:1. The length is greater than the width. A method is also provided including providing a polymeric structure, wrapping the polymeric structure around a first substrate at least two full circuits, positioning the polymeric structure at least partially within an aperture defined by a second substrate, and subjecting the polymeric structure to an elevated temperature above the transition temperature of the crosslinked polymeric layer and below the degradation temperature of each of the components in the polymeric structure. The thickness of the polymeric structure increases, creating at least a partial joint between the first substrate and the second substrate. |
