| 摘要 |
<p>The present invention provides a semiconductor package. The semiconductor package includes a substrate, a bottom semiconductor chip which is arranged on the substrate, a top semiconductor chip which is arranged on the bottom semiconductor chip and exposes both ends of the bottom semiconductor chip, a heat slag which is arranged on the top semiconductor chip, a molding layer which is provided between the substrate and the heat slag, and a top spacer which is interposed between the bottom semiconductor chip and the heat slag and is provided on both ends of the bottom semiconductor chip.</p> |
