<p>The present invention relates to a fan module. The fan module according to the present invention comprises: an impeller cover which has an inlet and covers one side of a housing; an impeller which is received in the impeller cover and is coupled to the rotary shaft of a motor received in the housing to be rotated; and a leak reducing member which is located on the inner surface of the impeller cover and reduces a leak between the impeller cover and the impeller.</p>
申请公布号
KR20140141308(A)
申请公布日期
2014.12.10
申请号
KR20130062920
申请日期
2013.05.31
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, CHANG HWAN;KANG, SEUNG ON;YANG, JI HAE;JUNG, IN YEOP;JUN, SANG OOK;HWANG, SE YEUN