| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method for automatically correcting an upper face height of the electronic component when a suction nozzle cannot suck the electronic component and suppressing deterioration in production efficiency by continuing a mounting operation. <P>SOLUTION: An electronic component mounting device includes a tray 5 where a plurality of pockets Tp are partitioned and formed, and a component transfer device installing a suction nozzle sucking an electronic component Q stored in a tray and mounting it on a substrate on an installation section. When the suction nozzle cannot suck the electronic component, the suction nozzle is removed from the installation section and a measurement head of a height measuring device is installed. The upper face height of the tray or that of the electronic component is measured for a plurality of prescribed places P1 to P6 in a component sampling region. The measurement head is removed from the installation section and the suction nozzle is installed. Deformation of the tray is estimated based on the measured upper face height for the plurality of prescribed places, and the upper face height of the electronic component stored in each pocket is corrected. The mounting operation is continued based on the corrected upper face height. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
