AN ADHESIVE FILM FOR RADIATING HEAT, A SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND A METHOD FOR PRODUCING THE DEVICE

摘要

The present invention relates to an adhesive film for radiating a heat, which comprises thermally conductive particles, located between a protective layer molding a semiconductor device and a heat radiation metal layer formed on the protective layer to adhere the protective layer and the heat radiation metal layer, and having the adhesion to the protective layer and the heat radiation metal layer be 3 kgf/25mm^2 or more respectively, to a semiconductor device comprising the same, and to a method for manufacturing the same.