发明名称 Heat dissipation of power electronics of a cooling unit
摘要 The present invention relates to cooling unit (100) for one or more heat generating devices provided on board of a means of transport, for example on board of an aircraft, the use of the cooling unit (100), a cooling system (10) comprising the cooling unit (100) and a means of transport, for example an aircraft, comprising the cooling unit (100). The cooling unit (100) comprises: power electronics (120) for providing the cooling unit (100) with electric power; a heat exchanger (180) for thermally coupling a cooling agent supplied by a central cooling system provided on board of the means of transport with air supplied in and/or into the cooling unit (100) in order to cool the air by means of the cooling agent to thereby provide cooling energy in the form of cold air to the one or more generating devices; and a heat pipe (140) for heat dissipation of the power electronics (120), wherein, at a first portion of the heat pipe (140), at least some of a working agent contained inside the heat pipe (140) is in the liquid phase and, at a second portion of the heat pipe (140), at least some of the working agent contained inside the heat pipe (140) is in the gas phase, wherein the first portion of the heat pipe (140) is thermally coupled with the power electronics (120) such that heat from the power electronics (120) is absorbed by evaporating the working agent being in the liquid phase and wherein the second portion of the heat pipe (140) is thermally coupled with the cooling agent such that heat is released to the cooling agent by condensing the working agent being in the gas phase.
申请公布号 EP2653386(B1) 申请公布日期 2014.12.10
申请号 EP20120164452 申请日期 2012.04.17
申请人 AIRBUS OPERATIONS GMBH 发明人 SCHULT, JENS;TRÜMPER, TORSTEN
分类号 B64D13/00;B64D13/06;B64D13/08;F25B31/00;H05K7/20 主分类号 B64D13/00
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