发明名称 Sealing member for electronic component package and electronic component package
摘要 <p>A sealing member for an electronic component package includes, on another principal surface of a base material (4) constituting the sealing member for the electronic component package, an external terminal electrode (53,54), a wiring pattern (55), and a resin material (99). The external terminal electrode (53,54) is to be electrically coupled to an outside of the electronic component package. The wiring pattern (55) is configured to couple an electronic component element (2) on one principal surface (42) of the base material (4) to the external terminal electrode (53,54). The resin material (99) is layered over the other principal surface (43) and the wiring pattern (55). The external terminal electrode (53,54) is layered over the wiring pattern (55) and the resin material (99). </p>
申请公布号 EP2432013(A3) 申请公布日期 2014.12.10
申请号 EP20110181302 申请日期 2011.09.14
申请人 DAISHINKU CORPORATION 发明人 KOHDA, NAOKI
分类号 H03H9/10;B81B7/00;H01L23/13;H01L23/15;H01L23/32;H01L23/48;H01L23/498;H03H9/21 主分类号 H03H9/10
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