<p>A method for forming a conductive pattern is provided. The method for forming a conductive pattern includes: a first process for forming a first paste layer which adds metal powder to a dielectric material; a second process for drying and heating the dielectric material after the first process; a third process for forming a second paste layer which includes a low melting point alloy on one side of the first paste layer after the second process; and a fourth process for heating the dielectric material after the third process.</p>
