| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive for a copper plating liquid to be used for a PR (periodic reverse) pulse electrolysis technique capable of improving the plating appearance, physical properties of the plating film, filling property and the like when electrolytic copper plating is carried out by supplying a PR pulse current. SOLUTION: The additive for the copper plating liquid to be used for the PR pulse electrolysis technique includes at least one kind of component selected from a group consisting of alkenes and alkynes. The copper plating liquid for the PR pulse electrolysis process includes an aqueous solution containing copper ions and at least one kind of acid component selected from organic acids and inorganic acids, as a basic plating bath, and further contains the additive. A copper plating method by the PR pulse electrolysis technique is provided, in which electrolytic copper plating is carried out on an object to be plated as a cathode in the copper plating liquid by supplying a PR pulse current. COPYRIGHT: (C)2010,JPO&INPIT |
