| 摘要 |
<p>In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount + Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm 2 or more to provide a flexible cupper clad laminate.</p> |
