| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device manufacturing method which can accurately position a semiconductor package without accompanying remarkable increase in facility costs. SOLUTION: A semiconductor package 15 having a resin encapsulated part 16 and outer leads 17 is placed on a lower mold 1 having a side rail 8. An upper mold 2 having a package holder 14 and a punch 12 is lowered and the semiconductor package 15 is transferred sideways by the package holder 14 and positioned with being pressed to the side rail 8. After the semiconductor package 15 is positioned, the outer leads 17 are processed by the punch 12. Because the package holder 14 obliquely contacts an outer periphery of the resin encapsulated part 16, downward transfer of the package holder 14 causes sideways transfer of the semiconductor package 15. COPYRIGHT: (C)2012,JPO&INPIT |
