USE OF A RESIN COMPOSITION AS A TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME

摘要

To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.