发明名称 無電解めっきの前処理方法
摘要 PROBLEM TO BE SOLVED: To provide a pretreatment method for electroless plating, which is simple and useful from a view point of environmental protection, and in which when electroless plating is performed, favorable adhesiveness between a metal plating and an article to be plated is exhibited by applying a pretreatment to the article to be plated. SOLUTION: The pretreatment method is conducted to the article to be plated before the article to be plated is subjected to electroless plating. The article to be plated is subjected to a primary treatment with an aqueous solution containing a salt or compound of aluminum, and then the article to be plated is subjected to a secondary treatment with an aqueous solution containing an organic silicon compound. COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5638472(B2) 申请公布日期 2014.12.10
申请号 JP20110132777 申请日期 2011.06.15
申请人 发明人
分类号 C23C18/18 主分类号 C23C18/18
代理机构 代理人
主权项
地址