| 摘要 |
<p>A magnetron sputter deposition system (100) for sputtering material is described. The system comprises at least two magnetron sputter units (102, 104), a power supply (110) for providing a power, the power supply (110) comprising an electrode wherein the at least two magnetron sputter units (102, 104) are simultaneously electrically connected to the same electrode of the power supply (110), and the magnetron sputter units are arranged so that they at least partly share a common plasma in the region between the at least two magnetron sputter units (102, 104).</p> |
