| 摘要 |
<p>Provided is a semiconductor device suitable for preventing film peeling due to dicing and preventing abnormal discharge. The semiconductor device includes a scribe region (003) and an IC region (004). At least one separation groove (007) is provide in an inter-layer insulating film (002) in the scribe region 003, and a side wall (011) made of a plug metal film is formed on each lateral wall of the separation groove (007). A passivation film is provided to cover at least the side walls (011).</p> |
