发明名称 導電性の基体表面の表面処理方法
摘要 #CMT# #/CMT# Method for surface treatment of an electrically conducting substrate surface comprises contacting a tool made from a solid material conducting ions for conducting the metal ions in the substrate surface and applying an electrical potential so that an electrical potential drop between the substrate surface and the tool is produced. The metal ions are removed from the substrate surface using the tool or deposited on the substrate surface. #CMT#USE : #/CMT# For forming micro- and nano-structures in a substrate surface. #CMT#ADVANTAGE : #/CMT# The production of chemical by-products is avoided. #CMT#METALLURGY : #/CMT# Preferred Features: The tool is pressed onto the substrate surface. The tool has a side facing and a side facing away from the substrate surface. The electrical potential is applied between the substrate surface and the side of the tool facing away from the substrate surface. The substrate has a copper surface and the tool is made from copper-rubidium chloride.
申请公布号 JP5640055(B2) 申请公布日期 2014.12.10
申请号 JP20120200152 申请日期 2012.09.12
申请人 发明人
分类号 C25F3/02;C25D5/00;C25F3/14;C25F7/00;G02B3/00;G02B5/18 主分类号 C25F3/02
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