发明名称 FILM TYPE CONTACT MEMBER FOR SEMICONDUCTOR PACKAGE TEST SOCKET, FILM TYPE CONTACT COMPLEX, AND THE SOCKET COMPRISING THE SAME
摘要 <p>The present invention relates to a film-type contact member and a contact composite including the same. The film-type contact member includes: an upper surface contact unit which is attached on the upper surface of a body block to surround the body block and has an upper terminal electrically connected to a ball terminal of a test target package; a side surface connection unit which has wires to be electrically connected to the upper surface contact unit; and a lower surface contact unit having a lower terminal which is formed by extending the wires formed on the side surface connection unit and is electrically connected to a DUT board on the end.</p>
申请公布号 KR101469222(B1) 申请公布日期 2014.12.10
申请号 KR20130076679 申请日期 2013.07.01
申请人 NANO LIGUID DEVICES KOREA CO., LTD.;OKINS ELECTRONICS CO., LTD. 发明人 CHA, SANG HOON;JUN, JIN GUK
分类号 G01R1/067;G01R31/26;H01L21/66 主分类号 G01R1/067
代理机构 代理人
主权项
地址