发明名称 |
FILM TYPE CONTACT MEMBER FOR SEMICONDUCTOR PACKAGE TEST SOCKET, FILM TYPE CONTACT COMPLEX, AND THE SOCKET COMPRISING THE SAME |
摘要 |
<p>The present invention relates to a film-type contact member and a contact composite including the same. The film-type contact member includes: an upper surface contact unit which is attached on the upper surface of a body block to surround the body block and has an upper terminal electrically connected to a ball terminal of a test target package; a side surface connection unit which has wires to be electrically connected to the upper surface contact unit; and a lower surface contact unit having a lower terminal which is formed by extending the wires formed on the side surface connection unit and is electrically connected to a DUT board on the end.</p> |
申请公布号 |
KR101469222(B1) |
申请公布日期 |
2014.12.10 |
申请号 |
KR20130076679 |
申请日期 |
2013.07.01 |
申请人 |
NANO LIGUID DEVICES KOREA CO., LTD.;OKINS ELECTRONICS CO., LTD. |
发明人 |
CHA, SANG HOON;JUN, JIN GUK |
分类号 |
G01R1/067;G01R31/26;H01L21/66 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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