发明名称 半導体装置
摘要 It is an object of the invention to provide a thin, lightweight, high performance, and low in cost semiconductor device and a display device by reducing an arrangement area required for a power supply wiring and a ground wiring of a functional circuit and decreasing a drop in power supply voltage and a rise in ground voltage. In the functional circuit of the semiconductor device and the display device, a power supply wiring and a ground wiring are formed in a comb-like arrangement, and the tips thereof are electrically connected with a first wiring, a second wiring, and a contact between the first wiring and the second wiring, thereby forming in a grid-like arrangement. The drop in power supply voltage and the rise in ground voltage can be decreased and the arrangement area can be decreased in the grid-like arrangement.
申请公布号 JP5639910(B2) 申请公布日期 2014.12.10
申请号 JP20110017534 申请日期 2011.01.31
申请人 发明人
分类号 H01L21/822;G02F1/1343;G02F1/1345;G02F1/1362;G02F1/1368;H01L21/3205;H01L21/768;H01L21/77;H01L21/82;H01L21/84;H01L23/522;H01L27/04;H01L27/10;H01L27/12;H01L29/786;H01L51/50;H05B33/26 主分类号 H01L21/822
代理机构 代理人
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