Light emitting module

摘要

According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal.

主权项

1. A light emitting module, comprising:
a mounting substrate having a mounting face, and a pad provided on the mounting face; a plurality of light emitting chips mounted on the mounting face such that adjacent light emitting chips in the plurality are spaced from each other by a first distance; a transparent layer provided between the plurality of light emitting chips, the transparent layer not including a phosphor, and having a first transparent body and a scattering agent that is dispersed in the first transparent body, the scattering agent having a different refraction index from a refraction index of the first transparent body, the transparent layer spanning the first distance between adjacent light emitting chips in the plurality; and a phosphor layer provided on the transparent layer, and having a second transparent body and a phosphor dispersed into the second transparent body, each light emitting chip including:
a semiconductor layer having a first face, a second face opposite to the first face, and a light emitting layer;a p-side electrode provided on the second face in a region of the semiconductor layer including the light emitting layer;an n-side electrode provided on the second face in a region of the semiconductor layer not including the light emitting layer;a p-side external terminal provided between the p-side electrode and the pad, and electrically connected to the p-side electrode and the pad; andan n-side external terminal provided between the n-side electrode and the pad, and electrically connected to the n-side electrode and the pad, the first transparent body and the scattering agent of the transparent layer being provided between the plurality of light emitting chips and covering the first face of the semiconductor layer of each light emitting chip.